Driven by the increase in global demand for sensors for the smartphone and automotive markets, Amkor Technology Inc. is adding a new MEMS and sensor packaging line at its facility in Shanghai.

Tempe-based Amkor Technology Inc. recently announced its shipping of 700 million RF and front-end advanced system-in-package (SiP) modules that deliver high performance at low costs to mobile devices.

Amkor Technology Inc., a Tempe-based semiconductor packaging and test services provider, said last week that it has won IDG Enterprise’s 2016 CSO50 Award in recognition of its work in creating security programs that support business value.